• High boiling point with low pour point and low viscosity

• Low evaporation losses

• Wide choice of grades to optimize performance

• Use of high boiling grades to reduce evaporation losses without   affecting performance

• Excellent electrical resistivity(a billion times higher than   DI-water)

• No significant change in resistivity with use

• High transparency to Rf and Microwaves Power

• Low environmental load

• Low cost of ownership

• No resistivity monitoring necessary

• No risk of short circuiting even if leak occurs on to electronic   components

• High MTBF (Mean Time Between Failure)

• Better process control

• Excellent thermal and chemical stability

• Good compatibility with materials

• No corrosion or reaction with construction materials

• No formation of decomposition residues

• No circulating pump seizure due to fluid degradation or   corrosion

• No flash or fire points

• No Auto Ignition Point

• No Explosion hazards

• Enhanced safety

• Safe to use at high temperature

Semiconductors Front - End

Heat Transfer media for: Steppers, Dry - Etchers, CVD, PVD and Ion   Implanters

Excellent Dielectric Properties, Thermal Stability, Safety and Low   Cost of Ownership

Semiconductors Back - End

Heat Transfer media for: Probers

Excellent Dielectric Properties, Excellent Heat Transfer   Efficiency, Safety

Electronic

Heat Transfer media for: Testing Equipments

Excellent Dielectric Properties, Safety, Environmental Safety

• DI-Water and DI-Water/Glycol systems require maintenance control for   water resistivity and efficiency of de-ionization resins.

• GALDEN systems do not require resistivity monitoring and   de-ionization resins

• DI-Water and DI-Water/Glycol could lead to galvanic corrosion in presence   of dissimilar metals, there placement of corroded parts increases the   operation costs

• GALDEN systems are practically maintenance free and no corrosion problems   are encountered.

• DI-Water and DI-Water/Glycol tend to dissolve ions and become ionized   leading to damage due to short circuiting.

• GALDEN dielectric properties do not change with use, no short circuiting   risk.

Boiling point

°C

55

70

80

110

135

170

200

230

270

Pour point

°C

<–125

<–110

-110

-100

-100

-97

-85

-77

-66

Density

g/

1.65

1.68

1.69

1.71

1.72

1.77

1.79

1.82

1.85

Kinematic viscosity

cSt

0.45

0.50

0.57

0.77

1.00

1.80

2.40

4.40

14.00

Vapor pressure

torr

225

141

105

17

5.8

0.8

0.2

0.03

<

Specific heat

cal/g·°C

0.23

0.23

0.23

0.23

0.23

0.23

0.23

0.23

0.23

Heat of vaporizationat boiling point

cal/g

22

17

17

17

16

16

15

15

15

Refractive index

1.280

1.280

1.280

1.280

1.280

1.280

1.281

1.283

1.283

Coefficient of thermalexpansion

/·°C

0.0011

0.0011

0.0011

0.0011

0.0011

0.0011

0.0011

0.0011

0.0011

Surface tension

dyne/cm

14

14

16

16

17

18

19

19

20

Thermal conductivity

W/m·K

0.065

0.065

0.065

0.065

0.065

0.065

0.065

0.065

0.065

Dielectric strength

kV(2.54mm gap)

40

40

40

40

40

40

40

40

40

Dielectric constant

-

1.86

1.86

1.89

1.92

1.92

1.94

1.94

1.94

1.94

Volume resistivity

Ohm·cm

1·

1·

1.5·

1.5·

1.5·

1.5·

6·

6·

6·

Average molecularweight

Amu

340

410

430

580

610

760

870

1,020

1,550

Dissipation factor(1 Khz)

2·

2·

2·

2·

2·

2·

2·

2·

2·

Solubility of water

ppm(wt)

<10

<10

<10

<10

<10

<10

<10

<10

<10

Solubility of air

gas/100  liquid

26

26

26

26

26

26

26

26

26